Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly

Saturday, September 24th 2011

A recent article published in JACS is shortly explained and analyzed.


Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly

Reference: J. Am. Chem. Soc. 2011, 133 (37), pp 14488–14491

Title: Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly.

Authors: A. Rajendran, M. Endo, Y. Katsuda, K. Hidaka, and H. Sugiyama

Review by: Sergii Rudiuk

Introduction

Developed by Paul Rothemund, DNA origami is an interesting and rapidly developing field of nanotechnology. It consists in controlled 2- or 3-dimentional folding of long single strand DNA by Watson-Crick base pairing with multiple smaller "staple" strands. However, these structures can be used only at temperatures lower than DNA base pairs melting, i.e. ≤ 55 °C. The authors of this article focused on finding a way to increase the thermal stability of DNA origami structures.

Idea:

Authors used a cross-linker that can penetrate easily into the double helix and bind covalently and irreversibly to both strands of the DNA. A known psoralen (8-methoxypsoralen) ability to bind covalently DNA strands under UV irradiation was used for this purpose.
Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly

Results

Authors show that at optimal conditions (1h UV irradiation of DNA origami tails in the presence of 500 µM psoralen) the UV cross-linking of DNA strands leeded to 25-30 °C increase in DNA origami stability. The increase of thermal stability of DNA origami was used to perform one-dimentional self-assembly of 3 origami tiles at 60 °C (temperature at which the non-cross-liked tiles were found to melt). It was found that the yield of the self-assembly was increased from 40% to 61% when increasing the starting temperature of self-assembly from 50 to 60 °C.
Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly

Naresh Kumar Mani

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